Ultrasonic fine wire Al

In-house transducer manufacture. We can always avoid resonance issues.

Ultra gentle, ultra precise – lowest possible bonding force and power. Our BPC ensures deformation consistency on challenging applications.

Bonding to deformation and not to seconds. The BPC allows for the softest process with consistency peace of mind.

The classic spider with the long flat loops.

The loop geometry varies from every wire.

For fine pitch we select a higher frequency for minimal deformation & ultra narrow bonds.

Using 20µm wire together with specialist concave tools we can get down to 30µm pitch.

For high current Hybrids HF packages the Complex 3D looping is easy to program through the F&K GUI.

F&K has been producing dual head power electronic bonders since 1983.

The Bond Academy offers a wide range of statistical analysis templates.