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M17S wire bonder

THE SMALLEST

The one with the widest space utilisation.

Your products

MEMS, SENSORS
OPTO, RF/HF
COB, HYBRID
POWER DEVICES
POWER SYSTEMS
BMS
Diode
Diode Laser
Hybrid
Circuit board
Capacitor
BMS

The compact, space-saving wire bonder F & K M17S is a true multi-talent. In no time at all, it can be converted to all common wire bonding methods.

For maximum productivity at low operating costs, the application specialists at F&K Delvotec match the automation depth precisely to the customer's product: Smartomation as a guarantee for low total cost of ownership.

 

 

The advantages

  • M17 platform suitable for all wire bonding processes  
  • Quick and easy changeover in less than 15 minutes
  • Versatile automation options from manual to inline
  • Working area: X = 254 mm (10”) ; Y = 152mm (6”) ; Z = 40mm

  • Continuous monitoring and active control of the bonding process through patented Bond Process Control

 

 

The options

  • With lift system

  • Manual pick-up

  • Conveyor lines for in-line automation

  • Customer-specific indexer system for components or workpiece carriers

M17S: Fully automatic wire bonder with one bond head - Our technologies