Ultrasonic heavy wire Al 375 - 500 µm

Lead terminals – oscillation & contamination are often a challenge here.

S shape bonds for Maximum power density.

Best energy density and thermal performance can be achieved with the Back-cut short loop capability.

High Step down loops onto ENIG.

High Step down loops onto DBC.

Laser solution prefered.

The BPC adjusts ultrasonic power & duration to regulate deformation in real time for every bond.

Although the BPC cannot correct an un-bondable surface, it can compensate for inconsistency.

Here the contamination has increased the bond time until the desired deformation is achieved.

Many use the BPC to intelligently activate selective pull testing based on the BPC pre-defined thresholds.

The front-cut options offers simplicity and very simple servicing.

The back cut techniques is ideal for bonding onto a chip. We operate the cutter with micro meter precision to cut 90° through the wire. The remaining 10° is enough to pull the wire back under the tool and a clamp tear is performed.

At 3.5mm wide, our back cut tool is the slimmest available allowing for ultimate access. Wire feeding is also especially easy.