Join us at SemiconChina

From 26 to 28 March we will be at booth 3257 in hall N3 at the Shanghai New International Expo Centre.

Experience our M17-S Thin Wire Bonder live in action and exchange ideas directly with our technology experts! In addition to our ultrasonic bonding solutions, we will also be presenting innovative laser bonding technologies.

Be curious - we look forward to your visit!