Ultrasonic bonding - AI & machine learning

This was the title of the presentation given by our colleague Christoph Buchner, PhD Candidate, at the Digital Transformation Stage at this year's Hannover Messe.

Together with Christian Seidler from Fraunhofer IPA, the two gave an insight into machine learning-based quality prediction in ultrasonic wire bonding.

It was a great and exciting experience for both of them to be able to present STRAMAGROUP's innovative topics to an international audience of experts at the world's leading trade fair for industrial technologies.