ThrowBack Fair Tag Der Betriebe

As an exhibitor, we had the opportunity last week to give pupils from the Technical School in Munich an insight into our working world and our ultrasonic and laser bonding technology.

Our colleagues Hans Georg, Head of Bond Academy & Research Projects, and Patrick, Technical Editor, were not only available to answer any questions the students from the electrical engineering department had, they also had our M17S wire bonder with them, which met with great technical interest.

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