A token of appreciation - Thank you Infineon!
We recently had the pleasure of attending the Infineon Wire Bond and Metrology Equipment & Material Technology Development Forum 2023 in Melakka. Our Head of Bond Academy & Research Projects, Dr Hans-Georg von Ribbeck, presented our latest technologies for ultrasonic bonding and laser bonding for copper connectors.
We are very pleased about the award and proud of the partnership with Infineon.
