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Bonding
MEMS, SENSORS>
Ultrasonic fine wire Al
Ultrasonic fine wire Cu
Ultrasonic fine wire Au
Ultrasonic ball wedge Au
Ultrasonic ball wedge high access Au
OPTO, RF/HF>
Ultrasonic fine wire Al
Ultrasonic ball wedge Au
Ultrasonic ball wedge high access Au
Ultrasonic heavy ribbon Al
Ultrasonic deep access Al, AU
COB, HYBRID>
Ultrasonic fine wire Al
Ultrasonic fine wire Au
Ultrasonic ball wedge Au
Ultrasonic heavy wire Al 125 - 375 µm
POWER DEVICES>
Ultrasonic fine wire Al
Ultrasonic heavy wire Al 375 - 500 µm
Ultrasonic heavy wire Cu
Ultrasonic heavy ribbon Al
Laser ribbon Cu
Laser Tab Cu 300 - 800 µm
POWER SYSTEMS>
Laser simplification low induction Cu
Laser ribbon Cu
Laser Tab Cu 300 - 800 µm
BMS>
Ultrasonic heavy wire Al 125 - 375 µm
Laser ribbon Cu
Laser flex PCB ribbon Ni
Laser Tab Cu 50 - 300 µm
PCB, CASTING & AUTOMOTIVE>
Ultrasonic heavy wire Al 125 - 375 µm
Laser ribbon Cu
Laser ribbon Al
Laser PCB unsupported Al, Cu
Laser Tab Cu 300 - 800 µm
CELLS>
Ultrasonic heavy wire Al 375 - 500 µm
Laser ribbon Cu
Laser ribbon Al
Laser tab Al 0,5 - 2 mm
Laser Tab Cu 50 - 300 µm
Machines
Ultrasonic wire bonder>
M17S: Fully automatic wire bonder with one bond head
M17D: Fully automatic wire bonder with two bond heads
M17L: Largest working range for thin wire bonding
M17XL: Fully automatic wire bonder with largest working range
Laser bonder>
M17LSB L: Combination of laser welding and wire bonding
M17LSB XL: Combination of laser welding and wire bonding
LAZ-Series>
DelvoLAZ
MegaLAZ
GigaLAZ
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F&K Delvotec
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Frohe Ostern - Happy Easter - 复活节快乐

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